B. Blampey

发表

Multiple wavelength silicon photonic 200 mm R+D platform for 25Gb/s and above applications

B. Szelag, B. Blampey, T. Ferrotti, 2016, Photonics Europe.

Presentation of a new time domain simulation tool and application to the analysis of advanced interconnect performance dependence on design and process parameters

B. Blampey, A. Farcy, O. Cueto, 2004, Proceedings. 8th IEEE Workshop on Signal Propagation on Interconnects.

20Gb/s PAM-4 transmission from 35 to 90°C by modulating a Silicon Ring Resonator Modulator with 2Vpp

B. Blampey, Sylvie Menezo, M. Fournier, 2015, 2015 Optical Fiber Communications Conference and Exhibition (OFC).

Dielectric LossEffects ontheModeling ofInterconnect Responses forthe45nmNode

Thierry Lacrevaz, Cedric Bermond, Bernard Flechet, 2008 .

New design of analog and mixed-signal cells using back-gate cross-coupled structure

Yves Leduc, B. Blampey, Gilles Jacquemod, 2019, 2019 IFIP/IEEE 27th International Conference on Very Large Scale Integration (VLSI-SoC).

High-speed coherent silicon modulator module using photonic integrated circuits: from circuit design to packaged module

B. Blampey, A. Myko, D. Marris-Morini, 2016, Photonics Europe.

Performance predictions of interconnect networks for advanced technology nodes

Cedric Bermond, Bernard Flechet, Pascal Ancey, 2009 .

Impact of dummies on interconnects network HF propagation performances for the 65nm node

Cedric Bermond, Bernard Flechet, B. Blampey, 2006 .

Impact of process parameters on circuit performance for the 32nm technology node

Cedric Bermond, Bernard Flechet, B. Blampey, 2007 .

Millimeter-wave Rat-race Balun in a CMOS 65nm Technology with Slow-wave Transmission Lines and Innovative Topology

Philippe Ferrari, B. Blampey, E. Pistono, 2012 .

Delay and Crosstalk on Future 32 nm Node Interconnects: Impact of ULK-Air-Gap Architecture

B. Blampey, O. Cueto, B. Flechet, 2006, 2006 IEEE Workship on Signal Propagation on Interconnects.

Experimental characterization of dummies impact on interconnects propagation performance. Optimization of dummy sizes for the CMOS 22 nm technology node

B. Blampey, B. Flechet, M. Gallitre, 2008, 2008 12th IEEE Workshop on Signal Propagation on Interconnects.

Up to 64-QAM modulation of a Silicon-Ring-Resonator-Modulator

B. Blampey, A. Myko, Sylvie Menezo, 2014, OFC.

Experimental characterization ofdummiesimpact oninterconnects propagation performance. Optimization ofdummysizes fortheCMOS 22nm technology node

Cedric Bermond, B. Blampey, M. Gallitre, 2008 .

Simulation of signal propagation with prospective air gap architectures as potential solutions to achieve Moore's law for the 32 nm node and below Cu Introduction of ULK

B. Blampey, B. Flechet, J. Torres, 2006, 2006 International Interconnect Technology Conference.

A 35.6 TOPS/W/mm² 3-Stage Pipelined Computational SRAM With Adjustable Form Factor for Highly Data-Centric Applications

B. Giraud, B. Blampey, R. Gauchi, 2020, IEEE Solid-State Circuits Letters.

Method and installation for inspection and / or sorting combining surface analysis and bulk analysis

B. Blampey, David Mouneyrac, Antoine Bourely, 2011 .

Impact of copper dummies on interconnect propagation performance in advanced integrated circuits

Cedric Bermond, Bernard Flechet, B. Blampey, 2004 .

A Near-Instantaneous and Non-Invasive Erasure Design Technique to Protect Sensitive Data Stored in Secure SRAMs

Bastien Giraud, B. Blampey, Lorenzo Ciampolini, 2021, ESSCIRC 2021 - IEEE 47th European Solid State Circuits Conference (ESSCIRC).

Capacitive impacts of dummies on interconnect propagation performances for integrated circuits of the 65 nm node and below

B. Blampey, A. Farcy, O. Cueto, 2005, Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005..

Optimization of a 64Gbps O-band Thin-Rib PN Junction Mach-Zehnder Modulator Fabricated on a 200mm Silicon Photonics Platform

B. Szelag, B. Blampey, S. Brision, 2018, Extended Abstracts of the 2018 International Conference on Solid State Devices and Materials.

Novel cost effective butt-coupled PIN germanium photodetector integrated in a 200mm silicon photonic platform

B. Szelag, B. Blampey, S. Malhouitre, 2016, 2016 IEEE 13th International Conference on Group IV Photonics (GFP).

Optimization of signal propagation performances in interconnects of the 45 nm node by exhaustive analysis of the technological parameters impact

V. Arnal, J. Torres, B. Blampey, 2005, Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005..