Aniket Ajay Lad

Conventional and topologically optimized polymer manifolds for direct cooling of power electronics

Muhammad Jahidul Hoque, J. Balda, W. King, 2023, International Journal of Heat and Mass Transfer.

Reduced Order Design Optimization of Liquid Cooled Heat Sinks

W. King, N. Miljkovic, K. James, 2021, Journal of Electronic Packaging.

High power density thermal management of discrete semiconductor packages enabled by additively manufactured hybrid polymer-metal coolers

Muhammad Jahidul Hoque, J. Balda, W. King, 2023, Applied Thermal Engineering.

Topology Optimized Fin Designs for Base Plate Direct-Cooled Multi-Chip Power Modules

Yue Zhao, W. King, N. Miljkovic, 2023, 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).