Tomohiro Nishiyama

A Study on Adaptive Cancellation of Impulse Noise in OFDM Transmission

Makoto Itami, Tatsufumi Shirai, Tomohiro Nishiyama, 2002 .

Development of CoC (Chip-on-Chip) Interconnection technology in hyperfine pitch : Packaging technology

Tomohiro Nishiyama, Yoshiaki Morishita, Seiya Isozaki, 2003 .

System in wafer-level package technology with RDL-first process

Tomohiro Nishiyama, Masaya Kawano, Kazuyuki Mineo, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).