S. Chungpaiboonpatana

Packaging of copper/low-k IC devices: a novel direct fine pitch gold wirebond ball interconnects onto copper/low-k terminal pads

S. Chungpaiboonpatana, F.G. Shi, F. Shi, 2004, IEEE Transactions on Advanced Packaging.

Process and design analysis for ultrafine-pitched wiresweep elimination in advanced copper heat spreader BGA package

S. Chungpaiboonpatana, F.G. Shi, 2005, IEEE Transactions on Advanced Packaging.

Electrical reliability of conductive adhesive joints: curing conditions and current density dependence

Frank G. Shi, H. K. Kim, S. Chungpaiboonpatana, 2000, SPIE Advanced Lithography.

Electrical conduction of anisotropic conductive adhesives: effect of size distribution of conducting filler particles

Frank G. Shi, Kikuo Okuyama, S. Chungpaiboonpatana, 1999 .

Advanced HiCTE flip chip packaging of 90-nm Cu/Low-K chips: Underfill, novel terminal pad structures, and processing optimization

Frank G. Shi, S. Chungpaiboonpatana, F. Shi, 2005 .

Copper trace cracking of BGA packages under die perimeter: combined effect of mold compound and die attach materials

S. Chungpaiboonpatana, F.G. Shi, 2004, IEEE Transactions on Device and Materials Reliability.