J. Ye

Experimental identification of warpage origination during the wafer level packaging process

L. Luo, Gaowei Xu, Wenguo Ning, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

Fabrication of through substrate grooves on GaAs by deep wet etching and its application in GaAs CCD wafer level packaging

L. Luo, Gaowei Xu, Shuangfu Wang, 2015 .

Fabrication of through substrate grooves on GaAs by deep wet etching and its application in GaAs CCD wafer level packaging

L. Luo, S. F. Wang, J. Ye, 2013, Microsystem Technologies.

A new designed trench structure to reduce the wafer warpage in wafer level packaging process

L. Luo, Gaowei Xu, Chunsheng Zhu, 2014, 2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy.