Viorel Dragoi

发表

Plasma-activated wafer bonding: the new low-temperature tool for MEMS fabrication

Viorel Dragoi, Gerald Mittendorfer, Christine Thanner, 2007, SPIE Microtechnologies.

Adhesive wafer bonding using photosensitive polymer layers

Viorel Dragoi, Erkan Cakmak, Elliott Capsuto, 2009, Microtechnologies.

Wafer bonding for MEMS and CMOS integration

Viorel Dragoi, Gerald Mittendorfer, Eric Pabo, 2011, Microtechnologies.

Vertically coupled GalnAsP/lnP microring lasers fabricated by using full wafer bonding

Kevin A. Williams, Viorel Dragoi, Ute Troppenz, 2007 .

Cobalt-manganese oxide thin films thermistors obtained by MOD

Viorel Dragoi, Marin Alexe, 1998, 1998 International Semiconductor Conference. CAS'98 Proceedings (Cat. No.98TH8351).

Novel Photolithography Yield-Enhancement Technique: Megasonic-Enhanced Development

Viorel Dragoi, Johanna Bartel, Don Dussault, 2010 .

Control of cavitation density through gas and acoustic uniformity in a proximity megasonic pre-bond cleaning system

Viorel Dragoi, Don Dussault, E. Liebscher, 2013, Microtechnologies for the New Millennium.

Pre-bond megasonic cleaning with improved process control

Viorel Dragoi, Frank Fournel, Don Dussault, 2014 .

High Efficiency Cleaning Processes for Direct Wafer Bonding

Viorel Dragoi, Donald Dussault, Jan Rothballer, 2016 .

Enabling Wafer Level Processes for CIS Manufacturing

Viorel Dragoi, Paul Lindner, Eric Pabo, 2010 .

Chapter Thirty Seven – Wafer-Bonding Equipment

Viorel Dragoi, Paul Lindner, 2010 .

Waferbonded active/passive vertically coupled microring lasers

Kevin A. Williams, Viorel Dragoi, Dimitris Syvridis, 2008, SPIE OPTO.

From magic to technology: materials integration by wafer bonding

Viorel Dragoi, 2006, SPIE OPTO.

Plasma activated wafer bonding for MEMS

Viorel Dragoi, Paul Lindner, S. Farrens, 2005, SPIE Microtechnologies.

Electrical and optical characterization of PbTiO3/Si heterostructures for applications in optoelectronics

Viorel Dragoi, Ioana Pintilie, D. Petre, 1998, ROMOPTO International Conference on Micro- to Nano- Photonics III.

High Precision Low Temperature Direct Wafer Bonding Technology for Wafer-Level 3D ICs Manufacturing

Viorel Dragoi, Bernhard Rebhan, Florian Kurz, 2016 .

Cyclo-olefin polymer direct bonding using low temperature plasma activation bonding

Takafumi Suzuki, Viorel Dragoi, Hiroyuki Ishida, 2005, The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05..

Reversible wafer bonding for reliable compound semiconductor processing

Viorel Dragoi, Gerald Mittendorfer, Paul Lindner, 2002, Proceedings. International Semiconductor Conference.

Wafer Bonding Process Selection

Viorel Dragoi, Eric Pabo, 2010 .

Mechanisms for room temperature direct wafer bonding

Viorel Dragoi, Kurt Hingerl, Markus Wimplinger, 2013 .

CMOS image sensor wafer-level packaging

Viorel Dragoi, Paul Lindner, Markus Wimplinger, 2011, 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.

Metal Thermocompression Wafer Bonding for 3D Integration and MEMS Applications

Viorel Dragoi, Gerald Mittendorfer, Jürgen Burggraf, 2010 .

Advanced Anodic Bonding Processes For MEMS Applications

Viorel Dragoi, Paul Lindner, Thomas Glinsner, 2003 .

Adhesive wafer bonding with photosensitive polymers for MEMS fabrication

Viorel Dragoi, Erkan Cakmak, Elliott Capsuto, 2010 .

Low Temperature MEMS Manufacturing Processes: Plasma Activated Wafer Bonding

Viorel Dragoi, S. Farrens, 2005 .

CMOS: compatible wafer bonding for MEMS and wafer-level 3D integration

Viorel Dragoi, Gerald Mittendorfer, Eric Pabo, 2012 .

Wafer-scale integration of GaAs optoelectronic devices with standard Si integrated circuits using a low-temperature bonding procedure

Viorel Dragoi, E. D. Kyriakis-Bitzaros, Alexandros Georgakilas, 2002 .

Plasma Activation for Low Temperature Wafer Bonding

Viorel Dragoi, Kurt Hingerl, Thomas Plach, 2008 .

Adhesive wafer bonding for MEMS applications

Viorel Dragoi, Gerald Mittendorfer, Paul Lindner, 2003, SPIE Microtechnologies.