Gerald Mittendorfer

Plasma-activated wafer bonding: the new low-temperature tool for MEMS fabrication

Viorel Dragoi, Gerald Mittendorfer, Christine Thanner, 2007, SPIE Microtechnologies.

Wafer bonding for MEMS and CMOS integration

Viorel Dragoi, Gerald Mittendorfer, Eric Pabo, 2011, Microtechnologies.

Imprint Lithography for Large Scale Angular Encoders

Gerald Mittendorfer, Thomas Glinsner, Michael Muehlberger, 2007 .

300mm Wafer-Level Image Sensor Packaging

Gerald Mittendorfer, Paul Lindner, Alex Feldman, 2011 .

Reversible wafer bonding for reliable compound semiconductor processing

Viorel Dragoi, Gerald Mittendorfer, Paul Lindner, 2002, Proceedings. International Semiconductor Conference.

Metal Thermocompression Wafer Bonding for 3D Integration and MEMS Applications

Viorel Dragoi, Gerald Mittendorfer, Jürgen Burggraf, 2010 .

CMOS: compatible wafer bonding for MEMS and wafer-level 3D integration

Viorel Dragoi, Gerald Mittendorfer, Eric Pabo, 2012 .

Adhesive wafer bonding for MEMS applications

Viorel Dragoi, Gerald Mittendorfer, Paul Lindner, 2003, SPIE Microtechnologies.