M. Tsai

Electronic properties of heterocyclic aromatic hydroxyl rigid-rod polymers

Y.-H. Tang, S. Bai, C. C. Wu, 2004 .

The East Asian Parkinson Disease Genomics Consortium

M. Nalls, C. Blauwendraat, J. Hardy, 2021, The Lancet Neurology.

Effect of Cu concentration, solder volume, and temperature on the reaction between SnAgCu solders and Ni

C. Kao, Szu-Chi Yang, M. Tsai, 2010 .

Effect of Sn concentration on massive spalling in high-Pb soldering reaction with Cu substrate

Hao-Hsiang Chuang, C. Kao, Yueh Lin, 2009 .

Sn concentration effect on the formation of intermetallic compounds in high-Pb/Ni reactions

C. Kao, M. Tsai, M. Tsai, 2010 .

Composite damping ratio of seismically isolated regular bridges

J. S. Hwang, Mong-Hsun Tsai, Kuo-Chu Chang, 1997 .

Uncovering the driving force for massive spalling in the Sn-Cu/Ni system

Meng-Che Tsai, C. Kao, Szu-Chi Yang, 2010 .