Hyunsik Kim

Signal Integrity Verification in Coplanar Interconnect Line

Y. Eo, Z. B. Khan, Hyunsik Kim, 2009 .

Modeling and Signal Integrity Analysis of Mounting Pad with Layer-cutting to reduce Impedance Mismatch for Dual-In-Line Memory Module (DIMM)

Seungyoung Ahn, Keunwoo Kim, Jongwook Kim, 2021, 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).

Fast eye diagram determination for the signal integrity verification of frequency-variant transmission lines

Yungseon Eo, Hyunsik Kim, Dongchul Kim, 2009, 2009 International SoC Design Conference (ISOCC).

High-Frequency-Measurement-Based Frequency-Variant Transmission Line Characterization and Circuit Modeling for Accurate Signal Integrity Verification

Yungseon Eo, Hyunsik Kim, Y. Eo, 2007, 8th International Symposium on Quality Electronic Design (ISQED'07).