M. Zhou

发表

Microstructural evolution and change in macroscopic physical properties of microscale flip chip Cu/Sn58Bi/Cu joints under the coupling effect of electric current stressing and elastic stress

C. Ke, S. Liang, Xin-Ping Zhang, 2019, Journal of Materials Research.

Effect of some N-heterocyclic inhibitors in the soldering flux on the corrosion behavior of eutectic Sn–58Bi alloy and its solder paste

X. Ning, Min-bo Zhou, Xin-Ping Zhang, 2018, 2018 19th International Conference on Electronic Packaging Technology (ICEPT).

Effect of activators and surfactants in halogen-free fluxes on wettability of Sn-0.7Cu-0.05Ni solder on Cu substrate

Xin-Ping Zhang, X. Ma, M. Zhou, 2013, 2013 14th International Conference on Electronic Packaging Technology.

Solder Preforms Composed of High Cu-content Sn-xCu Alloys for Power Electronic Packaging and Characterization of the Processing Performance and Joint's Properties

Xin-Ping Zhang, Ruoxi Shi, Ming-Qiang Chen, 2021, 2021 22nd International Conference on Electronic Packaging Technology (ICEPT).

Influence of solder volume and interfacial reaction on the undercooling and solidification microstructure of BGA structure Cu/Sn-3.0Ag-0.5Cu/Cu joints

Xin-Ping Zhang, Lang Zhang, M. Zhou, 2014, 2014 15th International Conference on Electronic Packaging Technology.

Undercooling Behavior and Intermetallic Compound Coalescence in Microscale Sn-3.0Ag-0.5Cu Solder Balls and Sn-3.0Ag-0.5Cu/Cu Joints

Min-bo Zhou, Xin-Ping Zhang, X. Ma, 2012, Journal of Electronic Materials.

Low cycle fatigue performance of ball grid array structure Cu/Sn-3.0Ag-0.5Cu/Cu solder joints

Hong-Bo Qin, Wang-Yun Li, Min-Bo Zhou, 2014, Microelectron. Reliab..

Effect of isothermal aging on mechanical properties and strain rate sensitivity of the eutectic Sn-58Bi solder alloy

Xin-Ping Zhang, X. Ma, Can Yin, 2017, 2017 18th International Conference on Electronic Packaging Technology (ICEPT).

Creep behavior of Cu/Sn-3.0Ag-0.5Cu/Cu solder joints under tensile stress coupled with DC current stressing

Min-bo Zhou, Xin-Ping Zhang, M. Zhou, 2015, 2015 16th International Conference on Electronic Packaging Technology (ICEPT).

An extensive simulation study of the interfacial delamination in molded underfill flip-chip packages by finite element method based on virtual crack closure technique

Hao Wang, Min-bo Zhou, Xin-Ping Zhang, 2022, 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).

Three-dimensional Finite Element Analysis of Interfacial Delamination in Molded Underfill Flip-Chip Packages by Virtual Crack Closure Technique

Min-bo Zhou, Xin-Ping Zhang, Guangshui Lyu, 2022, 2022 23rd International Conference on Electronic Packaging Technology (ICEPT).

Finite Element Simulation Study of Interfacial Crack Propagation in the Underfilled FC-BGA Package

Hao Wang, C. Ke, Min-bo Zhou, 2021, 2021 22nd International Conference on Electronic Packaging Technology (ICEPT).

A cost-effective and high performance assembly technology for interconnecting the Cu/Al bilayer electrode and lead wire of ZnO varistor using a low Ag-containing solder paste

Min-bo Zhou, Xin-Ping Zhang, M. Zhou, 2018, 2018 19th International Conference on Electronic Packaging Technology (ICEPT).

Influence of pre-existing void in the solder joint on electromigration behavior of Cu/Sn58Bi/Cu joints

H. Qin, W. Yue, Xin-Ping Zhang, 2013, 2013 14th International Conference on Electronic Packaging Technology.

Influences of the initial thickness of the interfacial IMC layer on electromigration behavior of Cu/Sn/Cu microscale joints

H. Qin, W. Yue, Xin-Ping Zhang, 2012 .

Coupled phase field and finite element modeling of void evolution and physical property change of micro flip-chip solder joints under electromigration and elastic stress field

C. Ke, S. Liang, Xin-Ping Zhang, 2017, 2017 18th International Conference on Electronic Packaging Technology (ICEPT).

Electromigration induced microstructure evolution and damage in asymmetric Cu/Sn-58Bi/Cu solder interconnect under current stressing

H. Qin, W. Yue, Min-bo Zhou, 2014 .

The Melting Characteristics and Interfacial Reactions of Sn-ball/Sn-3.0Ag-0.5Cu-paste/Cu Joints During Reflow Soldering

J. Q. Huang, M. Zhou, X. P. Zhang, 2017, Journal of Electronic Materials.

Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on BGA packaging

Xin-Ping Zhang, Jia-Qiang Huang, M. Zhou, 2016, 2016 17th International Conference on Electronic Packaging Technology (ICEPT).

Quasi in-situ study of morphological evolution of the interfacial IMC in single-sided interface Sn-0.3Ag-0.7Cu/Cu joints during multiple reflow process

C. Ke, Min-bo Zhou, Xin-Ping Zhang, 2015, 2015 16th International Conference on Electronic Packaging Technology (ICEPT).

Size and constraint effects on mechanical and fracture behavior of micro-scale Ni/Sn3.0Ag0.5Cu/Ni solder joints

Y. Mai, H. Qin, Min-bo Zhou, 2014 .

Interaction effect between electromigration and microstructure evolution in BGA structure Cu/Sn-58Bi/Cu solder interconnects

C. Ke, H. Qin, W. Yue, 2014, 2014 15th International Conference on Electronic Packaging Technology.

Interaction effect between electromigration and microstructure evolution in Cu/Sn-58Bi/Cu solder interconnect

C. Ke, H. Qin, W. Yue, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

Isothermal aging effect on microstructure and mechanical properties of Ni/Sn3.0Ag0.5Cu/Ni interconnects with the decreasing height

Xin-Ping Zhang, Jing-Bo Zeng, M. Zhou, 2013, 2013 14th International Conference on Electronic Packaging Technology.

A multi-phase field study of the role of grain boundary diffusion in growth of Cu6Sn5 intermetallic compound during early stage of soldering reaction

C. Ke, Xin-Ping Zhang, M. Zhou, 2013, 2013 14th International Conference on Electronic Packaging Technology.

Undercooling and solidification behavior of Sn-Ag-Cu solder balls and Sn-Ag-Cu/UBM joints

Min-bo Zhou, Xin-Ping Zhang, Jing-Bo Zeng, 2013, 2013 14th International Conference on Electronic Packaging Technology.

Influence of soldering temperature and dwelling time on morphological evolution of Cu 6 Sn 5 intermetallic compound at the Sn-3.0Ag-0.5Cu/Cu interface

S. Cao, Xin-Ping Zhang, Jing-Bo Zeng, 2012 .

Dissolution behavior of Cu UBM in BGA structure Sn-3.0Ag-0.5Cu/Cu joints during liquid isothermal aging at and above the solder's melting temperature

Xin-Ping Zhang, Jing-Bo Zeng, X. Ma, 2012 .

Early Interfacial Reaction and Formation of Intermetallic Compounds in the Sn-3.5Ag/Cu Soldering System

Min-bo Zhou, Xin-Ping Zhang, X. Ma, 2011 .

Interfacial reaction and melting/solidification characteristics between Sn and different metallizations of Cu, Ag, Ni and Co

H. Qin, Xin-Ping Zhang, X. Ma, 2010, 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.

The interfacial thermo-mechanical reliability of 3D memory-chip stacking with through silicon via array

H. Qin, Xin-Ping Zhang, M. Zhou, 2015, 2015 16th International Conference on Electronic Packaging Technology (ICEPT).

Dynamic wetting behavior and solder ball spattering formation of Sn-Bi solder pastes during reflow soldering process

Fang Ma, Min-bo Zhou, Xin-Ping Zhang, 2016, 2016 17th International Conference on Electronic Packaging Technology (ICEPT).

Influence of geometry of microbump interconnects on thermal stress and fatigue life of interconnects in copper filled through silicon via structure

H. Qin, Xin-Ping Zhang, M. Zhou, 2013, 2013 14th International Conference on Electronic Packaging Technology.

Phase field simulation of microstructural evolution and thermomigration-induced phase segregation in Cu/Sn58Bi/Cu interconnects under isothermal aging and temperature gradient

C. Ke, X. Zhang, S. Liang, 2019, Microelectronics Reliability.

Effects of flux activators and processing parameters on solderability and stability of the aluminum solder paste used for automated assembly of LED lighting components

Xin-Ping Zhang, Lang Zhang, Fu-Shun Qiu, 2016, 2016 17th International Conference on Electronic Packaging Technology (ICEPT).

Shear strength and fracture behavior of locally-melted hybrid Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu joints under different loading rates

W. Yue, Xin-Ping Zhang, M. Zhou, 2019, 2019 20th International Conference on Electronic Packaging Technology(ICEPT).

Phase field study of the combined effects of electromigration and thermomigration on phase segregation and physical properties of Sn58Bi solder joints under electric current stressing coupled with temperature gradient

C. Ke, S. Liang, Min-bo Zhou, 2018, 2018 19th International Conference on Electronic Packaging Technology (ICEPT).

Microstructures and shear properties of mixed assembly BGA structure SnAgCu/SnBi(Ag)/Cu joints in board-level packaging

Xing-Fei Zhao, Xin-Ping Zhang, Jia-Qiang Huang, 2017, 2017 18th International Conference on Electronic Packaging Technology (ICEPT).

Interfacial reactions and microstructural evolution of BGA structure Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu mixed assembly joints during isothermal aging

Xin-Ping Zhang, Jia-Qiang Huang, M. Zhou, 2016, 2016 17th International Conference on Electronic Packaging Technology (ICEPT).

Phase field simulation of Kirkendall voids at the interface of microscale Sn/Cu system lead-free interconnects

C. Ke, S. Liang, Xin-Ping Zhang, 2014, 2014 15th International Conference on Electronic Packaging Technology.

Three-Dimensional Simulation of the Thermo-Mechanical Interaction between the Micro-Bump Joints and Cu Protrusion in Cu-Filled TSVs of the High Bandwidth Memory (HBM) Structure

W. Le, C. Ke, S. Liang, 2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

Reliability and failure analysis of electronic components induced by the reflection of laser beam in the laser jet solder ball bonding process

Min-bo Zhou, Xin-Ping Zhang, Yue Wu, 2017, 2017 18th International Conference on Electronic Packaging Technology (ICEPT).

Experimental and numerical study of the size effect on microstructure and mechanical behavior of Cu/Sn0.7Cu0.05Ni/Cu joints with very small solder volume

H. Qin, Xin-Ping Zhang, Wei Li, 2012 .

Effect of loading rate on the shear performance and fracture behavior of micro-scale BGA structure Cu/Sn–3.0Ag–0.5Cu/Cu joints under coupled electromechanical loads

W. Le, Tao Sun, Xin-Ping Zhang, 2019, 2019 20th International Conference on Electronic Packaging Technology(ICEPT).

Interfacial reaction and IMC growth between the undercooled liquid lead-free solder and Cu metallization

W. Yue, Xin-Ping Zhang, M. Zhou, 2016, 2016 17th International Conference on Electronic Packaging Technology (ICEPT).

Influences of Ag and Zn contents on interfacial microstructure and corrosion behavior of Sn–Zn–Ag/6061Al joints in antenna module packages

Tao Sun, Xin-Ping Zhang, Ze-Jun Zhang, 2019, 2019 20th International Conference on Electronic Packaging Technology(ICEPT).

Influence of the solder volume and reflow process on solderability of the aluminum solder paste and reliability of Sn-0.3Ag-0.7Cu/6061Al solder joints in packages of LED lighting components and structures

Xin-Ping Zhang, X. Ma, M. Zhou, 2016, 2016 17th International Conference on Electronic Packaging Technology (ICEPT).

Processing performance and microstructure of Sn-Zn based solders modified by Bi and mixed rare earth elements

Xin-Ping Zhang, X. Ma, Jia-Qiang Huang, 2012 .

Interfacial reactions and formation of intermetallic compound of Sn-ball/Sn-3.0Ag-0.5Cu-paste/Cu joints in flip-chip on BGA packaging

Xin-Ping Zhang, Jia-Qiang Huang, M. Zhou, 2015, 2015 16th International Conference on Electronic Packaging Technology (ICEPT).

joints in flip-chip on BGA packaging

Xin-Ping Zhang, M. Zhou, 2015 .

Phase Field Simulation of Segregation of the Bi-Riched Phase in Cu/Sn-Bi/Cu Solder Interconnects under Electric Current Stressing

C. Ke, S. Liang, Xin-Ping Zhang, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

Phase field simulation of the microstructural evolution and electromigration-induced phase segregation in line-type Cu/Sn-Bi/Cu solder interconnects

C. Ke, S. Liang, Xin-Ping Zhang, 2016, 2016 17th International Conference on Electronic Packaging Technology (ICEPT).

Preparation of a low temperature sintering silver nanoparticle ink and fabrication of conductive patterns on PET substrate

Min-bo Zhou, Xin-Ping Zhang, Can Yin, 2018, 2018 19th International Conference on Electronic Packaging Technology (ICEPT).

Fabrication of Flexible Printed Circuits on Polyimide Substrate by Using Ag Nanoparticle Ink through 3D Direct-writing and Reliability of the Printed Circuits

Xin-Ping Zhang, X. Ma, M. Zhou, 2021, 2021 22nd International Conference on Electronic Packaging Technology (ICEPT).

Processing and electrical properties of sodium citrate capped silver nanoparticle based inks for flexible electronics

Min-bo Zhou, Xin-Ping Zhang, Can Yin, 2017, 2017 18th International Conference on Electronic Packaging Technology (ICEPT).

Preparation of core-shell structured SiO2@Ag spheres and their role in improving micro-sized Ag flake filled electrically conductive adhesive for LED packaging

Min-bo Zhou, Xin-Ping Zhang, Han Jiang, 2017, 2017 18th International Conference on Electronic Packaging Technology (ICEPT).

A highly reliable die bonding approach for high power devices by low temperature pressureless sintering using a novel Cu nanoparticle paste

Min-bo Zhou, Xin-Ping Zhang, M. Zhou, 2020, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).

Atomic-scale study of Cu–Cu direct bonding with assistance of Cu nanoparticles as joining medium by molecular dynamics simulation

C. Ke, Xin-Ping Zhang, Shuai Liu, 2022, 2022 23rd International Conference on Electronic Packaging Technology (ICEPT).

Tin nanoparticles modified nano-silver paste for pressureless low-temperature sintering process

Min-bo Zhou, Xin-Ping Zhang, X. Ma, 2018, 2018 19th International Conference on Electronic Packaging Technology (ICEPT).

Effect of electric current stressing on the shear strength and fracture behavior of micro-scale BGA structured Cu/Sn–3.0Ag–0.5Cu/Cu joints

W. Le, X. Ning, Xin-Ping Zhang, 2018, 2018 19th International Conference on Electronic Packaging Technology (ICEPT).

Ultrasound-assisted soldering process performance of Sn-Ag-Ti(Ce, Ga) active solders on thin film ZnO substrate

Tao Sun, Xin-Ping Zhang, Ze-Jun Zhang, 2019, 2019 20th International Conference on Electronic Packaging Technology(ICEPT).

Electrical property of electrically conductive adhesives filled with micro-sized Ag flakes and modified by dicarboxylic acids

Min-bo Zhou, Xin-Ping Zhang, Jie-Fei Zhu, 2016, 2016 17th International Conference on Electronic Packaging Technology (ICEPT).

Study of the curing kinetics and heat resistance of isotropic conductive adhesive

Min-bo Zhou, Xin-Ping Zhang, Han Jiang, 2018, 2018 19th International Conference on Electronic Packaging Technology (ICEPT).

The influence of imposed electric current on the tensile fracture behavior of micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu solder joints

H. Qin, Xin-Ping Zhang, M. Zhou, 2014, 2014 15th International Conference on Electronic Packaging Technology.

Fabrication of a hybrid paste consisting of microscale Ag-plated Cu flakes and nanoscale Ag particles and characterization of low-temperature sintered hybrid paste joints

Xin-Ping Zhang, Jie-Fei Zhu, Hong Jin, 2016, International Conference on Electronic Packaging Technology.

Ingenious Method for Rapid Fabrication of a Highly Conductive Hybrid Film of Printed Cu Nanoparticle Layers Plated by Ag Nanoplates on a PET Substrate at Room Temperature

Xin-Ping Zhang, M. Zhou, Hai-Jun Huang, 2021, ACS Applied Electronic Materials.

Fabrication of oxidation-resistant submicron copper particles and the conductive ink as well as its sintering behavior on the flexible substrate

Min-bo Zhou, Xin-Ping Zhang, Can Yin, 2018, 2018 19th International Conference on Electronic Packaging Technology (ICEPT).

Effects of size distributions of copper nanoparticles on the pressureless bonding performance of the copper paste for die attachment

C. Ke, Xin-Ping Zhang, Ze-Jun Zhang, 2019, 2019 20th International Conference on Electronic Packaging Technology(ICEPT).

A Three-Dimensional Printable Liquid Metal-Like Ag Nanoparticle Ink for Making a Super-Stretchable and Highly Cyclic Durable Strain Sensor.

X. Ning, Min-bo Zhou, Tao Sun, 2021, ACS applied materials & interfaces.

The influence of standoff height and pad size on the Shear fracture behavior of BGA structured Cu/Sn3.0Ag0.5Cu/Cu interconnects

Min-bo Zhou, Xin-Ping Zhang, J. Xia, 2010, 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.

Fabrication of wearable strain sensor by using a novel hybrid Cu ink composed of bimodal Cu particle ink and Cu-based metal-organic decomposition ink

Xin-Ping Zhang, M. Zhou, Hai-Jun Huang, 2022, 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).