Min Xiang

Study of Warpage Evolution and Control for Six-Side Molded WLCSP in Different Packaging Processes

Fei Qin, Shuai Zhao, Yanwei Dai, 2020, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Extracting array acoustic logging signal information by combining fractional Fourier transform and Choi–Williams distribution

Min Xiang, Zhu-Wen Wang, Jing-Hua Liu, 2015 .

Effect of Nano Al2O3 Doping on Thermal Aging Properties of Oil-Paper Insulation

Yuan Yuan, Ruijin Liao, Min Xiang, 2018 .

Embedded Si Fan Out: A Low Cost Wafer Level Packaging Technology without Molding and De-Bonding Processes

Li Yang, Daquan Yu, Zhiyi Xiao, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).