G.Q. Zhang

发表

W.D. van Driel, R.A. Real, D.G. Yang, 2007, 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.
W.D. van Driel, G.Q. Zhang, L.G. Ernst, 2005, 2005 6th International Conference on Electronic Packaging Technology.
N. Tzannetakis, G.Q. Zhang, A. Wymyslowski, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..
W.D. van Driel, R.A. Real, D.G. Yang, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.
W.D. van Driel, G.Q. Zhang, H.P. Hochstenbach, 2006, EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems.
G.Q. Zhang, M. Graef, F. van Roosmalen, 2006, EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems.
W.D. van Driel, G.Q. Zhang, H.P. Hochstenbach, 2008, 2008 58th Electronic Components and Technology Conference.
W.D. van Driel, G.Q. Zhang, J.H.J. Janssen, 2006, EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems.
W.D. van Driel, M. Jansen, G.Q. Zhang, 2004, Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).
W.D. van Driel, S. Koh, G.Q. Zhang, 2011, 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
W.D. van Driel, G.Q. Zhang, J.J.M. Zaal, 2008, EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.
A. Mavinkurve, W.D. van Driel, D.G. Yang, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..
G.Q. Zhang, M. Graef, F. van Roosmalen, 2006, 56th Electronic Components and Technology Conference 2006.
W.D. van Driel, D.G. Yang, G.Q. Zhang, 2008, EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.
W.D. van Driel, G.Q. Zhang, R. van Silfhout, 2009, IEEE Transactions on Device and Materials Reliability.
W.D. van Driel, H. Nijmeijer, G.Q. Zhang, 2005, 2005 6th International Conference on Electronic Packaging Technology.
G.Q. Zhang, M. Graef, F. van Roosmalen, 2005, 2005 6th International Conference on Electronic Packaging Technology.
W.D. van Driel, G.Q. Zhang, R.A.B. Engelen, 2007, 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.
W.D. van Driel, K.M.B. Jansen, Xiaosong Ma, 2009, EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
R.H.J. Peerlings, G.Q. Zhang, R. Peerlings, 2005, 2005 6th International Conference on Electronic Packaging Technology.
D.G. Yang, G.Q. Zhang, H.J.L. Bressers, 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).
W.D. van Driel, G.Q. Zhang, R.A.B. Engelen, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.
W.D. van Driel, K.M.B. Jansen, D.G. Yang, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
S. Koh, G.Q. Zhang, W. V. van Driel, 2011, 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
W.D. van Driel, K.M.B. Jansen, D.G. Yang, 2005, EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..
Lei Liu, Fengze Hou, G.Q. Zhang, 2011, 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
W.D. van Driel, Xuejun Fan, G.Q. Zhang, 2008, IEEE Transactions on Components and Packaging Technologies.
W.D. van Driel, G.Q. Zhang, J.J.M. Zaal, 2008, 2008 58th Electronic Components and Technology Conference.
W.D. van Driel, F. Theunis, J. Bielen, 2008, EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.
Fengze Hou, Yang Hai, D.G. Yang, 2010, 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.
W.D. van Driel, D.G. Yang, G.Q. Zhang, 2005, 2005 6th International Conference on Electronic Packaging Technology.
K.M.B. Jansen, D.G. Yang, G.Q. Zhang, 2005, EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..
Xuejun Fan, G.Q. Zhang, W. van Driel, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..
K.M.B. Jansen, G.Q. Zhang, Xuejun Fan, 2004, IEEE Transactions on Components and Packaging Technologies.
Fengze Hou, G.Q. Zhang, Daoguo Yang, 2011, 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.
W.D. van Driel, K.M.B. Jansen, D.G. Yang, 2004, 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.
K.M.B. Jansen, Xiaosong Ma, G.Q. Zhang, 2006, 2006 7th International Conference on Electronic Packaging Technology.
K.M.B. Jansen, D.G. Yang, G.Q. Zhang, 2004, 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.
Lei Liu, Fengze Hou, Kailin Pan, 2010, 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.
W.D. van Driel, G.Q. Zhang, R.A.B. Engelen, 2006, 2006 7th International Conference on Electronic Packaging Technology.
G.Q. Zhang, A.W.J. Gielen, H. Ye, 2011, 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
A. Mavinkurve, G.Q. Zhang, M. van Soestbergen, 2008, EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.
W.D. van Driel, Xuejun Fan, G.Q. Zhang, 2008, IEEE Transactions on Components and Packaging Technologies.
W.D. van Driel, D.G. Yang, G.Q. Zhang, 2008, 2008 58th Electronic Components and Technology Conference.
D.G. Yang, G.Q. Zhang, W. van Driel, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).
K.M.B. Jansen, G.Q. Zhang, H.J.L. Bressers, 2004, 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.
W.D. van Driel, K.M.B. Jansen, Xiaosong Ma, 2008, 2008 International Conference on Electronic Packaging Technology & High Density Packaging.
W.D. van Driel, G.Q. Zhang, W. V. van Driel, 2003, Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003..
D.G. Yang, G.Q. Zhang, H.J.L. Bressers, 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).
W.D. van Driel, P.J.G. Schreurs, G.Q. Zhang, 2004, 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.
K.M.B. Jansen, D.G. Yang, G.Q. Zhang, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
G.Q. Zhang, G.Q. Zhang, L. Ernst, 2003, Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003..
Lei Liu, Fengze Hou, Yang Hai, 2011, 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.