W. Kpobie

THE INFLUENCE OF MORPHOLOGY AND TOPOLOGY OF REINFORCEMENTS ON THERMO-ELASTIC PROPERTIES OF COMPOSITES : APPLICATION TO ELECTRONIC COMPONENTS

P. Lipinski, M. Fendler, N. Bonfoh, 2022 .

3D Modeling of high count fine pitch flip chip assemblies

P. Lipinski, M. Fendler, N. Bonfoh, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Multi-site micromechanical modelling of thermo-elastic properties of heterogeneous materials

P. Lipinski, M. Fendler, N. Bonfoh, 2012 .

Three-Dimensional Thermomechanical Simulation of Fine-Pitch High-Count Ball Grid Array Flip-Chip Assemblies

P. Lipinski, W. Kpobie, C. Dreistadt, 2014, Journal of Electronic Materials.

3D modeling of flip chip assemblies with large array and small pitch: validation of the proposed model

P. Lipinski, M. Fendler, N. Bonfoh, 2013, 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

Characterization of the mechanical behavior of a Printed Circuit Board (PCB)

P. Lipinski, M. Fendler, N. Bonfoh, 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

Thermo-mechanical simulation of PCB with embedded components

W. Kpobie, M. Martiny, Sebastien Mercier, 2016, Microelectron. Reliab..