Kan Lee

Effect of EFO settings on microstructure and hardness in the FAB of copper bonding wire

Jingshen Wu, Dong Liu, Haibin Chen, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

The microstructure and texture evolution in the heat affected zone of copper bonding wire

Jingshen Wu, Dong Liu, Haibin Chen, 2011, 2011 IEEE 13th Electronics Packaging Technology Conference.

Effect of heat affected zone on the mechanical properties of copper bonding wire

Dong Liu, Jingshen Wu, Haibin Chen, 2011, Electronic Components and Technology Conference.

On the intermetallic corrosion of Cu-Al wire bonds

Matthias Petzold, Robert Klengel, Karina Leung, 2010, 2010 12th Electronics Packaging Technology Conference.

Investigation of Cu wire neck crack under thermal cycling test

Jingshen Wu, H. Fan, Haibin Chen, 2016, 2016 17th International Conference on Electronic Packaging Technology (ICEPT).