Tzu-Hsing Chiang

The corrosion behavior of Ag alloy wire bond on Al pad in molding compounds of various chlorine contents under biased-HAST

Kwang-Lung Lin, Louie Huang, C. Hung, 2016, 2016 International Conference on Electronics Packaging (ICEP).

The corrosion performance of Cu alloy wire bond on Al pad in molding compounds of various chlorine contents under biased-HAST

Kwang-Lung Lin, Louie Huang, Ping-Feng Yang, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).