C. Chu

Microstructure-dependent coarsening behavior of γ′ precipitates in CoNi-based superalloys

Yongchang Liu, Chong Li, Y. Guan, 2022, Intermetallics.

Investigating the Deformation, Breakage and Number on Conductive Particle of Flim-on-Glass Packaging Using Anisotropic Conductive Film Bonding

Chao-Ming Lin, Y. Chiou, C. Chu, 2017 .