C. Val

A New Chip Carrier for High Performance Applications: Integrated Decoupling Capacitor Chip Carrier (IDCCC)

C. Val, J. Martin, 1983 .

3-D interconnection for ultra-dense multichip modules

C. Val, T. Lemoine, 1990 .

Wafer level processing on re-built wafer for chip stacking

C. Val, J.-C. Souriau, O. Lignier, 2005, 2005 7th Electronic Packaging Technology Conference.

3D interconnection for ultra-dense multichip modules

C. Val, T. Lemoine, 1990, 40th Conference Proceedings on Electronic Components and Technology.

Alumina with a Thermal Conductivity Close to Beryllia

C. Val, N. Humbert, 1983 .

Hermetic plastic packages with applications to ruggedized boards

C. Val, D. Bourret, R. Sempere, 1991, [1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium.

Performance and reliability of a three-dimensional plastic moulded vertical multichip module (MCM-V)

J. Barrett, C. Val, F. Waldron, 1995, 1995 Proceedings. 45th Electronic Components and Technology Conference.

Thermal characterisation of vertical multichip modules MCM-V

Peter A. Ivey, J. M. Stern, J. Barrett, 1995 .