Joël Alexis

Microstructural evolutions of Sn-3.0Ag-0.5Cu solder joints during thermal cycling

Olivier Dalverny, J. B. Libot, Joël Alexis, 2018, Microelectron. Reliab..

Parametric identification of elastic-plastic constitutive laws using spherical indentation

Olivier Dalverny, Joël Alexis, Jean-Michel Desmarres, 2014 .

Micro-Scale Modeling of Carbon-Fiber Reinforced Thermoplastic Materials

Sébastien Mistou, Fethi Abbassi, Joël Alexis, 2010 .

Study and mechanical characterization of high temperature power electronic packaging

Olivier Dalverny, Moussa Karama, Joël Alexis, 2013 .

Experimental characterization of the mechanical behavior of two solder alloys for high temperature power electronics applications

Olivier Dalverny, Moussa Karama, Joël Alexis, 2015, Microelectron. Reliab..

Impact of disturbed drilling conditions on the surface integrity of a Nickel-base superalloy

Gilles Dessein, Vincent Dutilh, Joël Alexis, 2010 .