S. Costello

Review of test methods used for the measurement of hermeticity in packages containing small cavities

S. Costello, M. P. Y. Desmulliez, S. McCracken, 2010 .

Numerical modeling of the electroplating process for microvia fabrication

C. Bailey, S. Costello, N. Strusevich, 2013, 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

Piezoresistive membrane deflection test structure for the evaluation of hermeticity in low cavity volume MEMS and microelectronic packages

A. J. Walton, S. Cargill, S. Costello, 2012, 2012 IEEE International Conference on Microelectronic Test Structures.