T. Arikado

Electrical Properties in Si_ Ge_x Thin Films Prepared by Pulsed Ion-Beam Evaporation

Kiyoshi Yatsui, Makoto Hirai, Hisayuki Suematsu, 2003 .

Real time monitor of Cu pollution in clean room ambient near Cu CMP equipment

T. Arikado, M. Sasaki, Y. Itou, 2003 .

Improvement in reading precision of micro-ID engraved on wafer

K. Nakajima, T. Arikado, K. Fujimoto, 2003 .

Wet etching of HfO/sub 2/ assisted by excimer photon irradiation

T. Arikado, Hiroshi Sugahara, H. Nishimori, 2003 .

Ultra-low thermal budget CMOS process for 65nm-node low-operation-power applications

M. Yasuhira, K. Kiyono, T. Arikado, 2003, IEEE International Electron Devices Meeting 2003.

Additive mobility enhancement and off-state current reduction in SiGe channel pMOSFETs with optimized Si Cap and high-k metal gate stacks

Raj Jammy, Y. Akasaka, T. Arikado, 2009, 2009 International Symposium on VLSI Technology, Systems, and Applications.

Evaluation of transistor property variations within chips on 300-mm wafers using a new MOSFET array test structure

N. Kasai, T. Arikado, N. Izumi, 2004, IEEE Transactions on Semiconductor Manufacturing.

Depletion-free poly-Si gate high-k CMOSFETs

S. Kamiyama, T. Arikado, W.S. Kim, 2004, IEDM Technical Digest. IEEE International Electron Devices Meeting, 2004..

Pulsed-power applications to materials science

T. Arikado, T. Suzuki, K. Yatsui, 2003, Digest of Technical Papers. PPC-2003. 14th IEEE International Pulsed Power Conference (IEEE Cat. No.03CH37472).

Physics in Fermi level pinning at the polySi/Hf-based high-k oxide interface

Y. Akasaka, T. Arikado, K. Torii, 2004, Digest of Technical Papers. 2004 Symposium on VLSI Technology, 2004..

Proposal of new HfSiON CMOS fabrication process (HAMDAMA) for low standby power device

S. Kamiyama, T. Arikado, K. Torii, 2004, IEDM Technical Digest. IEEE International Electron Devices Meeting, 2004..