C. C. Chang

Infection at the site of implanted materials with and without preadhered bacteria

K. Merritt, C. C. Chang, C. C. Chang, 1994, Journal of orthopaedic research : official publication of the Orthopaedic Research Society.

Microbial adherence on poly(methyl methacrylate) (PMMA) surfaces.

K. Merritt, C. C. Chang, C. C. Chang, 1992, Journal of biomedical materials research.

Effect of Cu concentration, solder volume, and temperature on the reaction between SnAgCu solders and Ni

C. Kao, Szu-Chi Yang, M. Tsai, 2010 .

Interfacial Reaction Between 95Pb-5Sn Solder Bump and 37Pb-63Sn Presolder in Flip-Chip Solder Joints

Y. Lai, C. Kao, Y. W. Wang, 2010 .

Fundamental Study of the Intermixing of 95Pb-5Sn High-Lead Solder Bumps and 37Pb-63Sn Pre-Solder on Chip-Carrier Substrates

Y. Lai, C. Kao, Y. W. Lin, 2009 .

Interaction Between Ni and Cu Across 95Pb-5Sn High-Lead Layer

Yi-Shao Lai, H. Y. Chung, C. Kao, 2010 .

Analysis and Experimental Verification of the Volume Effect in the Reaction Between Zn-Doped Solders and Cu

C. Kao, S. Yang, Y. W. Wang, 2008 .