A. Martin

New approach for the assessment of the effect of plasma induced damage on MOS devices and subsequent design manual rules

A. Martin, A. Martin, 2007, 2007 IEEE International Integrated Reliability Workshop Final Report.

A versatile, via terminated electromigration test structure for various stress modes used during fast wafer level reliability (fWLR) testing

J. Fazekas, A. Martin, A. Pietsch, 2006, IEEE Transactions on Semiconductor Manufacturing.

Polysilicon resistive heated scribe lane test structure for productive wafer level reliability monitoring of NBTI

J. Fazekas, A. Martin, J. von Hagen, 2003, International Conference on Microelectronic Test Structures, 2003..

Wide-band waveguide and ridge waveguide T-junctions for diplexer applications

Kawthar A. Zaki, Ji-Fuh Liang, Xiao-Peng Liang, 1993 .

The challenge to record correct fast WLR monitoring data from productive wafers and to set reasonable limits

J. Fazekas, W. Muth, A. Martin, 2004, 2004 IEEE International Reliability Physics Symposium. Proceedings.

On the impact of the layout of MOSFET test-structures on NBTI-, PBTI- and HCS-lifetime due to PID

C. Schlunder, A. Martin, 2012, 2012 IEEE International Integrated Reliability Workshop Final Report.

Fast and reliable WLR monitoring methodology for assessing thick dielectrics test structures integrated in the kerf of product wafers

J. Fazekas, A. Martin, J. von Hagen, 2002, IEEE International Integrated Reliability Workshop Final Report, 2002..

A Study of NBTI and Short-Term Threshold Hysteresis of Thin Nitrided and Thick Non-Nitrided Oxides

T. Grasser, P.-J. Wagner, H. Reisinger, 2009, IEEE Transactions on Device and Materials Reliability.

Fast Wafer Level Reliability Monitoring: Quantification of Plasma-Induced Damage Detected on Productive Hardware

A. Martin, C. Bukethal, K.-H. Ryden, 2009, IEEE Transactions on Device and Materials Reliability.

Investigation into the Dependency of Plasma Induced Damage on the Structural MOS Geometry with a Fast WLR Stress and Measurement Sequence

C. Schlunder, A. Martin, P.-E. Oswald, 2006, 2006 IEEE International Reliability Physics Symposium Proceedings.

Multi-purpose EM test structure with electrical verification of the failure spot demonstrated using SWEAT for fast wafer level reliability monitoring

J. Fazekas, A. Martin, A. Pietsch, 2005, Proceedings of the 2005 International Conference on Microelectronic Test Structures, 2005. ICMTS 2005..