K. Siow

发表

Kim Shyong Siow, T. Song, T. Y. Song, 2001 .

K. Siow, A. Yap, M. S. Soh, 2004, Operative dentistry.

A. Mohammad, E. Mahmoudi, M. F. Mohd Razip Wee, 2020, International Journal of Environmental Science and Technology.

A. Yap, Adrian U J Yap, Varian T S Han, 2004, Operative dentistry.

N. Nayan, M. F. M. R. Wee, A. Masood, 2021, Plasma Chemistry and Plasma Processing.

K. S. Siow, H. Griesser, Sunil Kumar, 2019, Colloids and surfaces. B, Biointerfaces.

Chuantong Chen, Yutai Su, Xu Long, 2022, International Journal of Mechanical Sciences.

B. Y. Majlis, K. S. Siow, T. F. Chen, 2015, 2015 IEEE Conference on Sustainable Utilization And Development In Engineering and Technology (CSUDET).

M. F. M. R. Wee, N. Ahmed, Anuttam Patra, 2023, Scientific Reports.

Chuantong Chen, X. Long, Yinggui Guo, 2022, Journal of Materials Science: Materials in Electronics.

Yanhong Tian, Meiyu Wang, Xin Li, 2021, IEEE Transactions on Components, Packaging and Manufacturing Technology.

K. S. Siow, Y. Mei, Z. Wang, 2019, Die-Attach Materials for High Temperature Applications in Microelectronics Packaging.

A. Yap, M. S. Soh, K. Siow, 2004, Operative dentistry.

K. S. Siow, B. Majlis, Tiam Foo Chen, 2017, Materials science & engineering. C, Materials for biological applications.

Chuantong Chen, Yutai Su, Xu Long, 2022, Fatigue & Fracture of Engineering Materials & Structures.

K. S. Siow, Kim Shyong Siow, K. Siow, 2014, Journal of Electronic Materials.

A. S. Zuruzi, A. Zuruzi, S. T. Chua, 2019, Journal of Materials Science: Materials in Electronics.

S. T. Chua, K. Siow, 2019, Metals and Materials International.

A. Yap, K. Siow, N. Wong, 2003, Operative dentistry.

H. Griesser, Sunil Kumar, L. Britcher, 2006, International Conference on Neural Networks.

H. B. Wang, A. Yap, L. Gan, 2000, Operative dentistry.

A. Yap, M. S. Soh, K. Siow, 2004, Operative dentistry.

A. Yap, M. S. Soh, K. Siow, 2002, Operative dentistry.

K. S. Siow, Y. W. Chan, F. Husna, 2015, 2015 IEEE Conference on Sustainable Utilization And Development In Engineering and Technology (CSUDET).

B. Majlis, M. R. Buyong, K. Siow, 2018, 2018 IEEE International Conference on Semiconductor Electronics (ICSE).

K. S. Siow, K. Siow, 2019, Die-Attach Materials for High Temperature Applications in Microelectronics Packaging.

K. S. Siow, B. Majlis, A. A. Hamzah, 2018, 2018 IEEE International Conference on Semiconductor Electronics (ICSE).

K. S. Siow, K. Siow, 2012, 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT).

K. S. Siow, S. T. Chua, Z. A. Samah, 2018, 2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT).

A. S. Zuruzi, K. S. Siow, A. Zuruzi, 2015, Electronic Materials Letters.

B. Plank, B. Meyghani, M. Awang, 2019, Materialwissenschaft und Werkstofftechnik.

B. Plank, S. Emamian, B. Meyghani, 2019, Materialwissenschaft und Werkstofftechnik.

L. Pei, HongWen Zhang, Binghua Pan, 2017, 2017 International Conference on Electronics Packaging (ICEP).

K. Siow, 2022, 2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT).

K. S. Siow, Y. W. Chan, B. Yeop Majlis, 2016, Materials science & engineering. C, Materials for biological applications.

S. T. Chua, V. R. Manikam, K. Siow, 2019, Die-Attach Materials for High Temperature Applications in Microelectronics Packaging.

K. S. Siow, B. Majlis, P. Ng, 2020, Materials science & engineering. C, Materials for biological applications.

K. Siow, M. Eugenie, 2016, 2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference.