K. Feng

Ultra-precision grinding of 4H-SiC wafer by PAV/PF composite sol-gel diamond wheel

Zhaozhong Zhou, B. Lyu, Tianchen Zhao, 2021, Advances in Mechanical Engineering.

Effects of Changes in Gas Type and Partial Pressure on Chemical Mechanical Polishing Property of Si Substrate

Kai Feng, Zhaozhong Zhou, S. Kurokawa, 2019, ECS Journal of Solid State Science and Technology.

Fabrication and Application of Gel-Forming CeO2 Fixed Abrasive Tools for Quartz Glass Polishing

Zhaozhong Zhou, B. Lyu, T. Yin, 2022, International Journal of Precision Engineering and Manufacturing.

Fabrication and Application of Gel Forming Ultrafine Diamond Abrasive Tools

Kai Feng, Zhaozhong Zhou, B. Lyu, 2021, ECS Journal of Solid State Science and Technology.

Fabrication and Characterization of Gel-Forming Cr2O3 Abrasive Tools for Sapphire Substrate Polishing

Liang Zhao, Tianchen Zhao, Zhaozhong Zhou, 2022, Applied Sciences.

Contrast Experiments in Dielectrophoresis Polishing (DEPP)/Chemical Mechanical Polishing (CMP) of Sapphire Substrate

Ju Long Yuan, Xu Wang, Tianchen Zhao, 2019, Applied Sciences.

Experimental Study of Both-Sides Cylindrical Roller Machining Based on Ceramic Plate

Tianchen Zhao, B. Lyu, Julong Yuan, 2022, Lubricants.

Orthogonal Experimental Research on Dielectrophoresis Polishing (DEPP) of Silicon Wafer

J. Yuan, Q. Deng, Kai Feng, 2020, Micromachines.