Gweltaz Gaudin

Pre bonding metrology solutions for 3D integration

Didier Landru, Mariam Sadaka, Ionut Radu, 2010, 2010 IEEE International 3D Systems Integration Conference (3DIC).

Novel low temperature 3D wafer stacking technology for high density device integration

Sorin Cristoloveanu, Léa Di Cioccio, Thomas Signamarcheix, 2013, 2013 Proceedings of the European Solid-State Device Research Conference (ESSDERC).

Low temperature direct wafer to wafer bonding for 3D integration: Direct bonding, surface preparation, wafer-to-wafer alignment

Didier Landru, Mariam Sadaka, Ionut Radu, 2010, 2010 IEEE International 3D Systems Integration Conference (3DIC).

Keynote) Low Temperature SmartCutTM Process for 3D Integration

Shay Reboh, Laurent Brunet, Frédéric Mazen, 2020 .

3D monolithic integration: Stacking technology and applications

Bich-Yen Nguyen, Ionut Radu, Gweltaz Gaudin, 2015, 2015 International Conference on IC Design & Technology (ICICDT).