Robert Hannon

Pre bonding metrology solutions for 3D integration

Didier Landru, Mariam Sadaka, Ionut Radu, 2010, 2010 IEEE International 3D Systems Integration Conference (3DIC).

Low temperature direct wafer to wafer bonding for 3D integration: Direct bonding, surface preparation, wafer-to-wafer alignment

Didier Landru, Mariam Sadaka, Ionut Radu, 2010, 2010 IEEE International 3D Systems Integration Conference (3DIC).

Spatial and temporal thermal characterization of stacked multicore architectures

Eren Kursun, Jamil A. Wakil, Robert Hannon, 2012, JETC.

The HERMES Power System

Robert Hannon, B. Lacore, R. Prido, 1989 .