Bangke Ma

Investigation of the characteristics of overhang bonding for 3-D stacked dies in microelectronics packaging

Lei Han, Fuliang Wang, Junhui Li, 2011, Microelectron. Reliab..

Study on a cooling system based on thermoelectric cooler for thermal management of high-power LEDs

Lei Han, Junhui Li, Bangke Ma, 2011, Microelectron. Reliab..