Ling Gang Liu

Investigation of the characteristics of overhang bonding for 3-D stacked dies in microelectronics packaging

Lei Han, Fuliang Wang, Junhui Li, 2011, Microelectron. Reliab..

Design of Data Acquisition System Based on LabVIEW

Jun Yu Li, Ling Gang Liu, Jun Hui Li, 2012 .

Research of Multi-Axes Motion Control System Based on LabVIEW Platform

Jun Yu Li, Ling Gang Liu, Lu Hua Deng, 2012 .