Tanja Braun

发表

Steve Voges, Tanja Braun, Karl-Friedrich Becker, 2019, Micromachines.

Herbert Reichl, K.-F. Becker, M. Koch, 2005, Microelectron. Reliab..

Klaus-Dieter Lang, Lutz Stobbe, Tanja Braun, 2019, 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).

Klaus-Dieter Lang, Olaf Wittler, Ingolf Schlosser, 2016, 2016 6th Electronic System-Integration Technology Conference (ESTC).

Klaus-Dieter Lang, Steve Voges, Rolf Aschenbrenner, 2016, 2016 IEEE CPMT Symposium Japan (ICSJ).

Klaus-Dieter Lang, Rolf Aschenbrenner, Markus Wöhrmann, 2017, 2017 International Conference on Electronics Packaging (ICEP).

Klaus-Dieter Lang, R. Aschenbrenner, Steve Voges, 2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

Herbert Reichl, K.-F. Becker, M. Koch, 2006, Microelectron. Reliab..

J. Bauer, R. Aschenbrenner, K.-D. Lang, 2016 .

Klaus-Dieter Lang, Olaf Wittler, Bernhard Wunderle, 2012, 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

Klaus-Dieter Lang, R. Aschenbrenner, Steve Voges, 2018, 2018 International Wafer Level Packaging Conference (IWLPC).

Herbert Reichl, Alexander Neumann, Lars Böttcher, 2008, ArXiv.

Martin Schneider-Ramelow, Rolf Aschenbrenner, Tanja Braun, 2021, ECS Meeting Abstracts.

Klaus-Dieter Lang, Olaf Wittler, Tanja Braun, 2014, Proceedings of the 5th Electronics System-integration Technology Conference (ESTC).

Tanja Braun, Michael Toepper, M. Toepper, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

Herbert Reichl, K.-F. Becker, Rolf Aschenbrenner, 2002, 2002 Proceedings. 8th International Advanced Packaging Materials Symposium (Cat. No.02TH8617).

Herbert Reichl, K.-F. Becker, Rolf Aschenbrenner, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

Herbert Reichl, Lars Böttcher, Erik Jung, 2008 .

Andreas Ostmann, Herbert Reichl, Lars Böttcher, 2009 .

Herbert Reichl, K.-F. Becker, U. Oestermann, 2002, 4th Electronics Packaging Technology Conference, 2002..