V. Bader

A New Wafer Level Packaging Approach: Encapsulation, Metallization and Laser Structuring for Advanced System in Package Manufacturing

Andreas Ostmann, Herbert Reichl, A. Neumann, 2005 .

Duromer MID technology for system in package generation

H. Reichl, R. Aschenbrenner, T. Braun, 2004, 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004..

Reliability Potential Of Epoxy Based Encapsulants For Automotive Applications

Herbert Reichl, K.-F. Becker, M. Koch, 2005, Microelectron. Reliab..

Overmolded FC-SiP for Miniaturized Devices

H. Reichl, R. Aschenbrenner, K.-F. Becker, 2007, 2007 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium.

High-temperature reliability of Flip Chip assemblies

Herbert Reichl, K.-F. Becker, M. Koch, 2006, Microelectron. Reliab..