Hélène Frémont

发表

Effects of salt spray test on lead-free solder alloy

Jean-Yves Delétage, Alexandrine Guédon-Gracia, Hélène Frémont, 2016, Microelectron. Reliab..

Sequential environmental stresses tests qualification for automotive components

Hélène Frémont, Pascal Lecuyer, Manoubi Auguste Bahi, 2007, Microelectron. Reliab..

Migration induced IMC formation in SAC305 solder joints on Cu, NiAu and NiP metal layers

Hélène Frémont, Kirsten Weide-Zaage, Lutz Meinshausen, 2012, Microelectron. Reliab..

Failure analysis case study on a Cu/low-k technology in package: New front-side approach using laser and plasma de-processing

Hélène Frémont, Nathalie Labat, A. Aubert, 2010, Microelectron. Reliab..

Effects of ageing on the conducted immunity of a voltage reference: Experimental study and modelling approach

Jean-Yves Delétage, Hélène Frémont, Tristan Dubois, 2017, Microelectron. Reliab..

Qualification procedure for moisture in embedded capacitors

Hélène Frémont, Kirsten Weide-Zaage, Geneviève Duchamp, 2014, Microelectron. Reliab..

Evaluation by three-point-bend and ball-on-ring tests of thinning process on silicon die strength

Alexandrine Guédon-Gracia, Hélène Frémont, Samed Barnat, 2012, Microelectron. Reliab..

Migration induced material transport in Cu-Sn IMC and SnAgCu microbumps

Hélène Frémont, Kirsten Weide-Zaage, Lutz Meinshausen, 2011, Microelectron. Reliab..

Wearout estimation using the Robustness Validation methodology for components in 150 degreeC ambient automotive applications

Hélène Frémont, Pascal Lecuyer, Manoubi Auguste Bahi, 2010, Microelectron. Reliab..

Fast reliability qualification of SiP products

Xiaosong Ma, Hélène Frémont, Kaspar M. B. Jansen, 2009, Microelectron. Reliab..

Characterization and model of temperature effect on the conducted immunity of Op-Amp

Hélène Frémont, Tristan Dubois, Geneviève Duchamp, 2015, Microelectron. Reliab..

Failure analysis of GaAs microwave devices with plastic encapsulation by electro-optical techniques

Hélène Frémont, Nathalie Labat, Nathalie Malbert, 2013, Microelectron. Reliab..

A fast moisture sensitivity level qualification method

Xiaosong Ma, Hélène Frémont, Willem D. van Driel, 2010, Microelectron. Reliab..

Experimental power cycling on insulated TRIAC package: Reliability interpretation thanks to an innovative failure analysis flow

Hélène Frémont, Nathalie Labat, A. Aubert, 2011, Microelectron. Reliab..

A methodological approach for predictive reliability: Practical case studies

Alexandrine Guédon-Gracia, Hélène Frémont, Geneviève Duchamp, 2012, Microelectron. Reliab..

International dimension to increase Lifelong Learning possibilities in Europe

Hélène Frémont, Jean-Marc Thiriet, Hamed Yahoui, 2012, 2012 International Conference on Information Technology Based Higher Education and Training (ITHET).

A methodologic project to characterize and model COTS component reliability

Hélène Frémont, André Durier, C. Ghfiri, 2015, Microelectron. Reliab..

Microstructure evolution observation for SAC solder joint: Comparison between thermal cycling and thermal storage

Alexandrine Guédon-Gracia, Hélène Frémont, Maxime Berthou, 2009, Microelectron. Reliab..

Proceedings of the 28th European Symposium on the reliability of electron devices, failure physics and analysis

François Marc, Hélène Frémont, Nathalie Labat, 2017, Microelectron. Reliab..

Electro- and thermomigration-induced IMC formation in SnAg3.0Cu0.5 solder joints on nickel gold pads

Hélène Frémont, Bernard Plano, Kirsten Weide-Zaage, 2013, Microelectron. Reliab..

Conductive adhesive joint for extreme temperature applications

Jean-Yves Delétage, Hélène Frémont, J. B. Jullien, 2013, Microelectron. Reliab..

Improved Physical Understanding of Intermittent Failure in Continuous Monitoring Method

Hélène Frémont, Yves Danto, M. Brizoux, 2007, 2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits.

Dynamic void formation in a DD-copper-structure with different metallization geometry

Hélène Frémont, Kirsten Weide-Zaage, Yves Danto, 2007, Microelectron. Reliab..

A new methodology for the identification of ball bond degradation during high-temperature aging tests on devices in standard plastic packages

Hélène Frémont, Pascal Lecuyer, Manoubi Auguste Bahi, 2009, Microelectron. Reliab..

PhD in Electrical and Information Engineering in Europe: Towards a harmonization including LifeLong Learning

Olivier Bonnaud, Hélène Frémont, Jean-Marc Thiriet, 2012, 2012 International Conference on Information Technology Based Higher Education and Training (ITHET).

Combined creep characterisation from single lap shear tests and 3D implementation for fatigue simulations

Alexandrine Guédon-Gracia, Hélène Frémont, S. Pin, 2017, Microelectron. Reliab..

Sequential combined thermal cycling and vibration test and simulation of printed circuit board

Jean-Yves Delétage, Alexandrine Guédon-Gracia, Hélène Frémont, 2018, Microelectron. Reliab..

Moisture diffusion in Printed Circuit Boards: Measurements and Finite- Element- Simulations

Hélène Frémont, Kirsten Weide-Zaage, Walter Horaud, 2005, Microelectron. Reliab..

Editorial

François Marc, Hélène Frémont, Philippe Perdu, 2015, Microelectron. Reliab..

Dynamical IMC-growth calculation

Hélène Frémont, Kirsten Weide-Zaage, Lutz Meinshausen, 2015, Microelectron. Reliab..

Creep measurement and choice of creep laws for BGA assemblies' reliability simulation

Jean-Yves Delétage, Alexandrine Guédon-Gracia, Hélène Frémont, 2018, Microelectron. Reliab..

How to study delamination in plastic encapsulated devices

Jean-Yves Delétage, Hélène Frémont, Kirsten Weide-Zaage, 2004, Microelectron. Reliab..

Virtual prototyping in a Design-for-Reliability approach

Alexandrine Guédon-Gracia, Hélène Frémont, Samed Barnat, 2015, Microelectron. Reliab..

Torsion test applied for reballing and solder paste volume evaluation

Hélène Frémont, Yves Danto, M. Brizoux, 2007, Microelectron. Reliab..

High temperature ageing of microelectronics assemblies with SAC solder joints

Hervé Morel, Cyril Buttay, Alexandrine Guédon-Gracia, 2017, Microelectron. Reliab..

Electro- and thermo-migration induced failure mechanisms in Package on Package

Hélène Frémont, Kirsten Weide-Zaage, Lutz Meinshausen, 2012, Microelectron. Reliab..

Pushing toward the limits of acceleration: Example on wire-bond assemblies

Hélène Frémont, Bernard Plano, J. B. Jullien, 2012, Microelectron. Reliab..