Takehiro Kimura

Development of low cost, highly reliable CSP using gold-gold interconnection technology

Hirofumi Nakajima, Seiya Isozaki, Takehiro Kimura, 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

Proposal of a new engine hood for a hydraulic excavator in consideration of the operability

Shun Maruyama, Takashi Kawai, Takehiro Kimura, 2017 .

Fan-Out Wafer-Level Packaging with highly flexible design capabilities

Hiroaki Kobayashi, Masaya Kawano, Takehiro Kimura, 2010, 3rd Electronics System Integration Technology Conference ESTC.

System in wafer-level package technology with RDL-first process

Tomohiro Nishiyama, Masaya Kawano, Kazuyuki Mineo, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).