T. Loher
发表
H. Reichl,
A. Ostmann,
T. Loher,
2008,
2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference.
H. Reichl,
A. Ostmann,
T. Loher,
2008,
2008 IEEE 9th VLSI Packaging Workshop of Japan.
H. Reichl,
R. Aschenbrenner,
A. Ostmann,
2006,
2006 International Microsystems, Package, Assembly Conference Taiwan.
H. Reichl,
A. Ostmann,
T. Loher,
2008,
2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference.
H. Reichl,
A. Ostmann,
T. Loher,
2009,
2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference.
H. Reichl,
R. Aschenbrenner,
A. Ostmann,
2009,
2009 11th Electronics Packaging Technology Conference.
J. Vanfleteren,
H. Reichl,
D. Manessis,
2006,
2006 8th Electronics Packaging Technology Conference.
H. Reichl,
R. Aschenbrenner,
T. Braun,
2005,
Proceedings Electronic Components and Technology, 2005. ECTC '05..