M. Seckel

Highly integrated flexible electronic Circuits and Modules

H. Reichl, A. Ostmann, T. Loher, 2008, 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference.

Stretchable electronic systems for wearable and textile applications

H. Reichl, A. Ostmann, T. Loher, 2008, 2008 IEEE 9th VLSI Packaging Workshop of Japan.

Manufacturing Concepts for Stretchable Electronic Systems

H. Reichl, A. Ostmann, T. Loher, 2008, 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference.

Stretchable circuit board technology in textile applications

H. Reichl, A. Ostmann, T. Loher, 2009, 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference.

High Frequency Substrate Technologies for the Realisation of Software Programmable Metasurfaces on PCB Hardware Platforms with Integrated Controller Nodes

M. Schneider-Ramelow, R. Aschenbrenner, D. Manessis, 2019, 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).

Manufacturing of high frequency substrates as software programmable metasurfaces on PCBs with integrated controller nodes

M. Schneider-Ramelow, R. Aschenbrenner, A. Ostmann, 2020, 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).

Stretchable electronic systems: Realization and applications

H. Reichl, R. Aschenbrenner, A. Ostmann, 2009, 2009 11th Electronics Packaging Technology Conference.