B. Pahl

Highly integrated flexible electronic Circuits and Modules

H. Reichl, A. Ostmann, T. Loher, 2008, 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference.

Heterogeneous integration - packaging on and in organic substrates

Andreas Ostmann, J. Bauer, R. Aschenbrenner, 2011 .

A thermode bonding process for fine pitch flip chip applications down to 40 micron

Herbert Reichl, Rolf Aschenbrenner, B. Pahl, 2001, Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506).

Ultrathin assemblies on flexible substrates

H. Reichl, R. Aschenbrenner, B. Pahl, 2005, 2005 7th Electronic Packaging Technology Conference.