B. Pahl
发表
H. Reichl,
A. Ostmann,
T. Loher,
2008,
2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference.
Andreas Ostmann,
J. Bauer,
R. Aschenbrenner,
2011
.
Herbert Reichl,
Rolf Aschenbrenner,
B. Pahl,
2001,
Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506).
H. Reichl,
R. Aschenbrenner,
B. Pahl,
2005,
2005 7th Electronic Packaging Technology Conference.