Michel Cabrera

3D Plastronics for Smartly Integrated Magnetic Resonance Imaging Coils

Philippe Lombard, Tony Gerges, Vincent Semet, 2020, Frontiers in Physics.

The Potential of 3D-MID Technology for Omnidirectional Inductive Wireless Power Transfer

Bruno Allard, Philippe Lombard, Vincent Semet, 2018, 2018 13th International Congress Molded Interconnect Devices (MID).

Benefits of GaN transistors and embedding in PCB laminates

Cyril Buttay, Pascal Bevilacqua, Bruno Allard, 2019 .

Omnidirectional inductive wireless charging of a 3D receiver cube inside a box

Bruno Allard, Philippe Lombard, Vincent Semet, 2018, 2018 IEEE Wireless Power Transfer Conference (WPTC).

Modelization and characterization of 2D and 3D mid inductors for multidirectional inductive proximity sensing

Christian Vollaire, Philippe Lombard, Vincent Semet, 2016, 2016 12th International Congress Molded Interconnect Devices (MID).