Shufeng Zhao

Moisture Absorption and Diffusion Characterization of Molding Compound

Linda Zhai, Xu Chen, Shufeng Zhao, 2005 .

Investigation of delamination control in plastic package

Shufeng Zhao, Xingshou Pang, Xingshou Pang, 2009, Microelectron. Reliab..

Impact of hygroswelling and vapor pressure on delamination

Xu Chen, Shufeng Zhao, Jinzhong Yao, 2006, 2006 8th Electronics Packaging Technology Conference.

Enhanced mechanical properties of dissimilar MIG welded 7005-T6 and 6063-T6 alloys by PWHT

Ning Wang, C. Zhang, K. Lu, 2023, Materials Today Communications.

Moisture absorption of molding compound and organic substrate

Shufeng Zhao, Shufeng Zhao, 2011, 2011 International Symposium on Advanced Packaging Materials (APM).