Joeri De Vos

Hybrid backside illuminated CMOS image sensors possessing low crosstalk

Piet De Moor, Koen De Munck, Padmakumar Ramachandra Rao, 2011, Remote Sensing.

A study on power integrity in a 3D chip stack using dynamic power supply current emulation and power noise monitoring

Eric Beyne, Makoto Nagata, Yuuki Araga, 2014, Proceedings of the 5th Electronics System-integration Technology Conference (ESTC).

Methodologies to mitigate package induced stresses in the BEOL

Eric Beyne, Mario Gonzalez, Luka Kljucar, 2016, 2016 6th Electronic System-Integration Technology Conference (ESTC).

Impact of Via Density on the Mechanical Integrity of Advanced Back-End-of-Line During Packaging

Eric Beyne, Ingrid De Wolf, Mario Gonzalez, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

"Hole-in-One TSV", a New Via Last Concept for High Density 3D-SOC Interconnects

Eric Beyne, Anne Jourdain, Andy Miller, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).