Taotao Chen

Performance assessments of porous FeCoNiCrAlx high-entropy alloys in high-temperature oxidation, carbonization and sulfidation atmospheres

G. Zheng, Huazhen Cao, Huibin Zhang, 2022, Journal of Alloys and Compounds.

Effect of bump shapes on the electromigration reliability of copper pillar solder joints

Junhui Li, Junfu Liu, Jinqing Xiao, 2021, 2021 22nd International Conference on Electronic Packaging Technology (ICEPT).

On-site leakage locating of underground natural gas pipeline based on Ne tracer by miniature time-of-flight mass spectrometry.

Keyong Hou, Ruidong Liu, Bing Liu, 2022, Talanta.

Response Behavior of Typical Wire Looping under Random Vibration for Wire Bonding Packaging

Junfu Liu, Hu He, Taotao Chen, 2022, International Conference on Electronic Packaging Technology.

Structure design and optimization of SOI high-temperature pressure sensor chip

Junhui Li, Zhong Jin, Xin Tang, 2021, Microelectron. J..