D. Tamboli

Mechanism of Copper Removal during CMP in Acidic H 2 O 2 Slurry

S. Seal, V. Desai, T. Du, 2004 .

Understanding the Reasons Behind Defect Levels in Post-Copper-CMP Cleaning Processes with Different Chemistries and PVA Brushes

W. Tseng, A. Philipossian, Y. Sampurno, 2021 .

Electrochemical characterization of copper chemical mechanical planarization in KIO3 slurry

V. Desai, Ying-tao Luo, T. Du, 2004 .

Novel Interpretations of CMP Removal Rate Dependencies on Slurry Particle Size and Concentration

D. Tamboli, G. Banerjee, M. Waddell, 2004 .

Environmental Degradation of Gas Turbine Materials in Steam

Y. Patel, V. Desai, N. Cheruvu, 1997 .

Mechanistic Understanding of Low κ Organosilicate Glass Film Planarization

A. Mallikarjunan, M. O'neill, R. Ridgeway, 2019, ECS Journal of Solid State Science and Technology.

Electrochemical characterization of copper chemical mechanical polishing

Vimal Desai, Tianbao Du, D. Tamboli, 2003 .