Shengchang Ding

Notch sensitivity of polymer-based thermal interface materials

Jibao Lu, Xiaoliang Zeng, Xiangliang Zeng, 2022, Journal of Applied Physics.

Soft Composite Gels with High Toughness and Low Thermal Resistance through Lengthening Polymer Strands and Controlling Filler

Jianbin Xu, Xiaoliang Zeng, Xiangliang Zeng, 2022, Advanced Functional Materials.

High Thermal Conductivity and Remarkable Damping Composite Gels as Thermal Interface Materials for Heat Dissipation of Chip

G. Du, Xiaoliang Zeng, Rong Sun, 2022, Chip.

Gecko-inspired adhesive structures enable efficiently thermal conductance and vibration dissipation in a highly mismatched system

Shan Gao, Xiaoliang Zeng, Rong Sun, 2022, Chemical Engineering Journal.