Chi-Yung Lee

Wafer Scale Phase‐Engineered 1T‐ and 2H‐MoSe2/Mo Core–Shell 3D‐Hierarchical Nanostructures toward Efficient Electrocatalytic Hydrogen Evolution Reaction

Hao-Chung Kuo, Yu-Lun Chueh, Je-Wei Chang, 2016, Advanced materials.

Amorphous zinc-doped silicon oxide (SZO) resistive switching memory: manipulated bias control from selector to memristor

T. Chin, Y. Chueh, Jiang Wu, 2014 .

High quality & low thermal resistance eutectic flip chip LED bonding

Ming Li, M. Wan, N. Lam, 2013, 2013 14th International Conference on Electronic Packaging Technology.

Direct Die to Wafer Cu Hybrid Bonding for Volume Production

Ming Li, T. Uhrmann, J. Burggraf, 2023, 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC).