S. Mick

Fine Pitch Inductively Coupled Connectors for Multi-Gbps Pulse Signaling

P. Franzon, J. Wilson, K. Chandrasekar, 2006, 2006 IEEE Electrical Performane of Electronic Packaging.

Buried bump and AC coupled interconnection technology

P. Franzon, J. Wilson, S. Mick, 2004, IEEE Transactions on Advanced Packaging.

Inductively Coupled Connectors and Sockets for Multi-Gb/s Pulse Signaling

P. Franzon, Jian Xu, Zhiping Feng, 2008, IEEE Transactions on Advanced Packaging.

AC coupled interconnect using buried bumps for laminated organic packages

Hsuan-Jung Su, Jian Xu, J. Wilson, 2006, 56th Electronic Components and Technology Conference 2006.

Buried solder bump connections for high-density capacitive coupling

P. Franzon, J. Wilson, S. Mick, 2002, Electrical Performance of Electronic Packaging,.

Inductively Coupled Board-to-Board Connectors

P. Franzon, Zhiping Feng, J. Wilson, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

Fully Integrated AC Coupled Interconnect Using Buried Bumps

Jian Xu, P.D. Franzon, J. Wilson, 2005, IEEE Transactions on Advanced Packaging.

Signal integrity and robustness of ACCI packaged systems

P. Franzon, Jian Xu, J. Wilson, 2005, IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005..