W. Hügel

发表

Synthesis, characterization and in situ Raman detection of Sn3O2(OH)2−xClx phases as intermediates in tin corrosion

R. Niewa, P. Eckold, M. Rolff, 2015 .

The surface energies of β-Sn - A new concept for corrosion and whisker mitigation

Pierre Eckold, M. S. Sellers, Rainer Niewa, 2015, Microelectron. Reliab..

Crystal structure of incommensurate ηʺ-Cu1.235Sn intermetallic

C. Wieser, A. Leineweber, W. Hügel, 2020 .

The monoclinic lattice distortion of η′-Cu6Sn5

C. Wieser, A. Leineweber, A. Walnsch, 2019, Journal of Alloys and Compounds.

Texture of electrodeposited tin layers and its influence on their corrosion behavior

Pierre Eckold, Rainer Niewa, Werner Hügel, 2014, Microelectron. Reliab..

Stabilization of the ζ-Cu10Sn3 Phase by Ni at Soldering-Relevant Temperatures

J. Freudenberger, C. Wieser, A. Leineweber, 2020, Journal of Electronic Materials.

Phase formation at the Sn/Cu interface during room temperature aging: Microstructural evolution, whiskering, and interface thermodynamics

U. Welzel, Jiangyong Wang, M. Sobiech, 2011 .

Local, submicron, strain gradients as the cause of Sn whisker growth

G. Ice, U. Welzel, W. Liu, 2009 .

Driving force for Sn whisker growth in the system Cu–Sn

U. Welzel, M. Sobiech, E. Mittemeijer, 2008 .

Cu6Sn5 intermetallic: Reconciling composition and crystal structure

C. Wieser, A. Leineweber, W. Hügel, 2020 .

Stress Relaxation Mechanisms of Sn and SnPb Coatings Electrodeposited on Cu: Avoidance of Whiskering

U. Welzel, M. Sobiech, J. Teufel, 2011 .

Two-Phase η′ + η Region in Cu6Sn5 Intermetallic: Insight into the Order–Disorder Transition from Diffusion Couples

C. Wieser, A. Leineweber, A. Walnsch, 2019, Journal of Electronic Materials.

Two Modifications of Tin(II) Bromide

R. Dinnebier, R. Niewa, P. Eckold, 2015 .

Evolution of microstructure and stress of and associated whisker growth on Sn layers sputter-deposited on Cu substrates

U. Welzel, Jiangyong Wang, J. Y. Wang, 2010 .