Fu Luo

A review: research progress of chemical–mechanical polishing slurry for copper interconnection of integrated circuits

N. Zhan, X. Niu, Han Yan, 2023, The International Journal of Advanced Manufacturing Technology.

Synergistic effect of 1,2,4-triazole and phytic acid as inhibitors on copper film CMP for ruthenium - based copper interconnected and the surface action mechanism analysis

Yinchan Zhang, Ziyang Hou, Yebo Zhu, 2023, Materials Science in Semiconductor Processing.

Effect and mechanism analysis of sarcosine on the chemical mechanical polishing performance of copper film for GLSI

Jiakai Zhou, Jianchao Wang, Yinchan Zhang, 2022, Materials Science in Semiconductor Processing.

Effect of hydroxy carboxylates as complexing agent on improving chemical mechanical polishing performance of M-plane sapphire and action mechanism analysis

Ziyang Hou, X. Niu, Han Yan, 2022, Ceramics International.

Analysis of the Adsorption and Passivation Mechanism of JFCE on Copper Surface in Alkaline CMP Slurry

Yinchan Zhang, X. Niu, Han Yan, 2023, China Semiconductor Technology International Conference.