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Effect of additives on Cu electrodeposits: electrochemical study coupled with EQCM measurements

M. Eyraud, L. Bonou, Y. Massiani, 2006 .

Voltametry and EQCM study of copper oxidation in acidic solution in presence of chloride ions

M. Eyraud, F. Vacandio, L. Bonou, 2007 .