George G. Harman

发表

Non-Destructive Tests Used to Insure the Integrity of Semiconductor Devices with Emphasis on Passive Acoustic Techniques

George G. Harman, G. Harman, 1979 .

Wire bonding to advanced copper, low-K integrated circuits, the metal/dielectric stacks, and materials considerations

George G. Harman, Christian E. Johnson, C. E. Johnson, 2002 .

Electronics Interconnections for Extreme Environments

George G. Harman, 2004 .

Reliability and Yield Problems of Wire Bonding in Microelectronics, The Application of Materials and Interface Science, International Society for Hybrid Microelectronics (ISHM) Monograph

George G. Harman, 1989 .

A Metallurgical Basis for the Non-Destructive Wire-Bond Pull-Test

George G. Harman, 1974 .

Assessment of Reliability Concerns for Wide-Temperature Operation of Semiconductor Devices and Circuits

Joseph J. Kopanski, George G. Harman, David W. Berning, 1991 .

Metallurgical Bonding Systems for High-Temperature Electronics Book Chapter

George G. Harman, 1998 .

Editorial Preface | NIST

George G. Harman, 2011 .

George G. Harman, 2011, Microelectron. Reliab..

Wire Bonding in Microelectronics | NIST

George G. Harman, G. Harman, 2010 .

Metallurgical Failure Modes of Wire Bonds

George G. Harman, 1974 .

Modern wire bonding technologies - ready for the challenges of future microelectronic packaging

Klaus-Dieter Lang, George G. Harman, Martin Schneider-Ramelo, 2005 .