文
论文分享
演练场
杂货铺
论文推荐
字
编辑器下载
登录
注册
Tobias Scheinost
发表
A Novel Approach for Reliability Investigation of LEDs on Molded Interconnect Devices Based on FE-Analysis Coupled to Injection Molding Simulation
Romit Kulkarni, Tobias Groezinger, Mahdi Soltani, 2019, IEEE Access.