Gerhard Klink

Polymer opto-chemical-electronic based module as a detection system for volatile analytes on a foil substrate

Karlheinz Bock, Indranil Bose, Anna Ohlander, 2012, Other Conferences.

Roll-To-Roll Microfabrication of Polymer Microsystems

Michael Feil, Karlheinz Bock, Christof Strohhöfer, 2007 .

Analysis of planar inductors on flexible substrates for RFID antennas

Ciprian Ionescu, Paul Svasta, Detlef Bonfert, 2010, 33rd International Spring Seminar on Electronics Technology, ISSE 2010.

Wafer bonding with an adhesive coating

Gerhard Klink, Bernhard Hillerich, 1998, Photonics West - Micro and Nano Fabricated Electromechanical and Optical Components.

Simultaneous fabrication of dielectric and electric joints by wafer bonding

Michael Feil, Gerhard Klink, Andreas Drost, 1998, Photonics West - Micro and Nano Fabricated Electromechanical and Optical Components.

Innovative packaging concepts for ultra thin integrated circuits

Frank Ansorge, Michael Feil, Herbert Reichl, 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

An Integrated 13.56-MHz RFID Tag in a Printed Organic Complementary TFT Technology on Flexible Substrate

Vincenzo Fiore, Egidio Ragonese, Giuseppe Palmisano, 2015, IEEE Transactions on Circuits and Systems I: Regular Papers.

Assembly of ultra thin and flexible ICs

Frank Ansorge, Michael Feil, Herbert Reichl, 2000, 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431).

Polymer opto-electronic-fluidic detection module on plastic film substrates

Karlheinz Bock, Christof Landesberger, Anna Ohlander, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Micro-contact printing of OTFT on polymer foils

Karlheinz Bock, Gerhard Klink, Martin Konig, 2009, 2009 59th Electronic Components and Technology Conference.

Microfluidics on foil: State of the art and new developments

Martin Richter, Karlheinz Bock, Gerhard Klink, 2008 .

New dicing and thinning concept improves mechanical reliability of ultra thin silicon

C. Landesberger, Rolf Aschenbrenner, Gerhard Klink, 2001, Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562).

Genotyping of single nucleotide polymorphisms by melting curve analysis using thin film semi-transparent heaters integrated in a lab-on-foil system.

Karlheinz Bock, Aman Russom, Marcella Chiari, 2013, Lab on a chip.

Ultra thin ICs and MEMS elements: techniques for wafer thinning, stress-free separation, assembly and interconnection

Michael Feil, C. Alder, Christof Landesberger, 2003 .