Lin Zhang

Dynamic Weld evolution during ultrasonic welding of Cu–Al joints

Hongjun Ji, Jianli Zhou, Qiuchen Ma, 2021, Materials Science and Engineering: A.

A Multilayer Paste Based on Ag Nanoparticles with Cu@Sn for Die Attachment in Power Device Packaging

C. Hang, Fengyi Wang, Hongtao Chen, 2022, Materials.

Enhanced antioxidant and size controllable Cu@Ag core-shell nanoparticles conductive inks for flexible printed electronics

Mingyu Li, Wenwu Zhang, Yichen Cao, 2019, 2019 20th International Conference on Electronic Packaging Technology(ICEPT).

Large-area flexible and transparent UV photodetector based on cross-linked Ag NW@ZnO NRs with high performance

Mingyu Li, H. Feng, Weiwei Zhao, 2021, Journal of Materials Science & Technology.